As a Third party testing organization certified with ISO/IEC17025, we arrange various evaluation tests such as weathering test (including Migration test, Thermal Shock test, High Accelerated Temperature, and Humidity Stress test), Failure analysis (including appearance, microsection and dimensional test), Electrical performance test (including Insulation resistance, withstanding voltage), Mechanical performance test (including Cross-cut test, Propagation Tear Strength, Peel Strength test), Flexibility test, and Foldability test.
Solder reflow test
Due to environmental regulations in the EU, we conduct a reflow mountability evaluation test to support confirming process and improvement of lead-free soldering as well as failure analysis and analysis of solder joint.
Solder heat resistance test
This test is to confirm if there is any abnormality on the sample surface by immersing the sample in a solder bath at a specified temperature for printed wiring boards, flexible printed wiring boards, copper-clad laminates for printed wiring boards, copper-clad laminates for flexible printed wiring boards, and evaluation for copper erosion into the solder.
Joint strength test
With the tip jig based on the part's shape, we conduct pull tests for QFP leads and the shear test of soldered joints for chip part. Perfect for reliability evaluation of solder joint after the thermal shock test when you change the condition of soldering (reflow) and material.
Migration test
Ionic migration is a phenomenon where a metallic material contacts with an insulating material and migrates to the surface or inside of the insulating material under an electric field and moisture absorption to cause insulation failure. Evaluates fluctuation of characteristic deterioration by long term energy supply inside the tank kept at a constant temperature and humidity. Applied voltage range is from 3V to 1000V.
Highly Accelerated temperature and humidity Stress Test—Pressure Cooker Test
HAST (Highly Accelerated temperature and humidity Stress Test) is an environmental test of electronic devices and measures stress under accelerated aging condition in unsaturated pressurized vaporous condition (85%RH) specified in IEC60068-2-66. Further accelerated testing can be conducted by PCT (Pressure Cooker Test) under saturated condition (100%RH).
Thermal shock test
Evaluates durability against temperature change on parts joint composed of some materials having different coefficient of thermal expansion on printed wiring board by stressing with rapid thermal shock applying low and high temperature alternation.
Flexibility test・Foldability test
Evaluates flexibility and foldability of flexible printed wiring board and material. It also evaluates bending durability of film products. Testing condition range: −20℃ – 90℃
Voltage-time test
Evaluates durability of insulated material and parts by applying high-voltage for long term. Measure holding-time applying specified voltage under accelerated aging condition and estimates the life time with approximate straight line.
SEM-EDX analysis
Using an electron beam, SEM visualizes contrast of the fine unevenness on samples that cannot be observed optically as well as differences in composition. Elemental analysis can be done with EDX. Effective for analyzing the cause of soldering defects on surfaces of pad electrodes, measuring dimension of thin-layer structures such as confirmation of the thickness of the solder leveling.
Thermal resistance measurement for Heat Dissipation Board
Based on the TMC LED02TG, IEC 61189-3-913, it evaluates thermal resistance and heat dissipation performance of a sample in the two directions: planar and thickness. Effective for heat dissipation evaluation of thin sample which is hard to evaluate with laser flash and of three-dimensional products such as heat sinks.
Standards
| Test | Standard number | Standard | Target object |
|---|---|---|---|
| Anti-voltage test / Dielectric breakdown test | JIS C 5012 | Test methods for printed wiring boards | printed wiring boards |
| JIS C 5016 | Test methods for flexible printed wiring boards | flexible printed wiring board | |
| JIS C 6471 | Test methods of copper-clad laminates for flexible printed wiring boards | copper-clad laminates for flexible printed wiring boards | |
| JIS C 6481 | Test methods of copper-clad laminates for printed wiring boards | copper-clad laminates for printed wiring boards | |
| IPC-TM-650 2.5.6.3 | Dielectric Breakdown Voltage and Dielectric Strength | Insulating material | |
| Surface volume resistance test | JIS C 5012 | Test methods for printed wiring boards | printed wiring boards |
| JIS C 5016 | Test methods for flexible printed wiring boards | flexible printed wiring boards | |
| JIS C 6471 | Test methods of copper-clad laminates for flexible printed wiring boards | copper-clad laminates for flexible printed wiring boards | |
| JIS C 6481 | >Test methods of copper-clad laminates for printed wiring boards | copper-clad laminates for printed wiring boards | |
| IPC-TM-650 2.5.17 | Volume Resistivity and Surface Resistance of Printed Wiring Materials | Printed wiring board material | |
| Connection solder strength test of lead | JIS Z 3198 | Lead-free solder test method | Lead-free solder mounting parts |
| JIS Z 3198-7 | |
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| Flexibility test | JIS C 5016 | Test methods for flexible printed wiring boards | flexible printed wiring boards |
| Foldability test | JIS C 6471 | Test methods of copper-clad laminates for flexible printed wiring boards | copper-clad laminates for flexible printed wiring boards |
| Cross section observation | － | － | － |
| SEM-EDX | － | － | － |
| Gas phase thermal shock test | JIS C 5012 | Test methods for printed wiring boards | printed wiring boards |
| JIS C 5016 | Test methods for flexible printed wiring boards | flexible printed wiring boards | |
| IPC-TM-650 2.6.7 | Thermal Shock & Continuity, Printed Board | Substrate, insulating material, solder paste | |
| Hot oil test | JIS C 5012 | Test methods for printed wiring boards | printed wiring boards |
| JIS C 5016 | Test methods for flexible printed wiring boards | flexible printed wiring boards | |
| IPC-TM-650 2.6.7 | Thermal Shock & Continuity, Printed Board | Substrate, insulating material, solder paste | |
| Migration test | JPCA-ET01 – 07-2007 | Environmental test method for printed wiring board | Substrate, insulation material |
| JIS Z 3197 | Soldering flux test method | Soldering flux | |
| JIS Z 3284 | Solder paste test method | Solder paste | |
| JIS C 60068 | Environmental test method －Electricity and electronics－ | Electrical and electronic parts | |
| IPC-TM-650 2.6.14.1 | Electrochemical Migration Resistance Test | Substrate, insulating material, solder paste | |
| HAST test | IEC60068-2-66 | Test methods – Test Cx: Damp heat, steady state | Small electronic parts |
| JIS C 0096 | Environmental test method －Electricity and electronics－ Damp heat, steady state (unsaturated pressurized vapour) | Small electronic parts | |
| JPCA-ET08 | Environmental test method for printed wiring boards - Damp heat, steady state (unsaturated pressurized vapour) | Small electronic parts | |
| PCT test | JPCA-ET08 | Environmental test method for printed wiring boards - Damp heat, steady state (unsaturated pressurized vapour) | Substrate, insulation material |
| Solder reflow test | JIS C 5012 | Test methods for printed wiring boards | printed wiring boards |
| Solder heat resistance test | JIS C 5012 | Test methods for printed wiring boards | printed wiring boards |
| JIS C 5016 | Test methods for flexible printed wiring boards | flexible printed wiring boards | |
| JIS C 6481 | Test methods of copper-clad laminates for printed wiring boards | copper-clad laminates for printed wiring boards | |
| JIS C 6471 | Test methods of copper-clad laminates for flexible printed wiring boards | flexible printed wiring boards | |
| IPC-TM-650 2.4.49 | Solder Pool Test | Substrate material | |
| Copper foil peel strength test | JIS C 5012 | Test methods for printed wiring boards | printed wiring boards |
| JIS C 5016 | Test methods for flexible printed wiring boards | flexible printed wiring boards | |
| JIS C 6481 | Test methods of copper-clad laminates for printed wiring boards | copper-clad laminates for printed wiring boards | |
| JIS C 6471 | Test methods of copper-clad laminates for flexible printed wiring boards | flexible printed wiring boards | |
| Relative permittivity / permittivity test | ASTM D150 | Standard Test Methods for AC Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulation | Insulating material |
| JIS C 6481 | Test methods of copper-clad laminates for flexible printed wiring boards | copper-clad laminates for flexible printed wiring boards | |
| Printed Electronics Reliability Assessment | IPC/JPCA-4921 | Requirements for Printed Electronics Base Materials (Substrates) | Printed electronics base material |
| IPC/JPCA-4591 | Requirements for Printed Electronics Functional Conductive Materials | Printed electronics base material | |
| V-t test | － | － | － |
| Thermal resistance measurement of heat dissipation substrate | IEC 61189-3-913 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs | LED heat dissipation board |
| JPCA-TMC-LED02TG-2015 | Guidelines for testing the heat dissipation characteristics of electronic circuit boards for high brightness LEDs | LED heat dissipation board | |
| JPCA-TMC-HR01S-2017 | High heat dissipation electronic circuit board for automotive electrical components and power devices | High heat dissipation electronic circuit board for automotive electrical components and power devices | |
| JPCA-TMC-HR02T-2017 | Test method for high heat dissipation electronic circuit board for automotive electrical components and power devices | High heat dissipation electronic circuit board for automotive electrical components and power devices |
Contact information
PIC: Tomoki Sumida (Mr.)
TEL:+81-3-3727-7111
