Power Devices Evaluation

Power Cycle Test / Transient Thermal Resistance Test (T3Ster)

Power Cycle Test/Transient Thermal Resistance Tester (T3Ster)

Maximum Load current of 1800A

The T3Ster test evaluates durability of power devices against electrical or thermal stress when they are electrically stressed periodically under ON / OFF states. The transient thermal resistance measurement mechanism (T3Ster) can detects failure phenomenon non-destructively,for example in structures around semiconductor chip, joint structures of chip – substrate -metal base plate, or cracks in joint structure of solder - AI wire.

Specification:
Maximum load current: 1800A (maximum)/12ch/12V
Power Cycle Test

Contact information
PIC: Tomoki Sumida (Mr.)
TEL:+81-3-3727-7111

Contact
Evaluation and Business menu

Standards

Test Standard number Standard Target object
Power Cycle Test/Transient Thermal Resistance Test(T3Ster) IEC60749-34 Semiconductor devices – Mechanical and climatic test methods – Part 34: Power cycling Power semiconductor device
AQG-324 Qualification of Power Modules for Use in Power Electronics Converter Units (PCUs) in Motor Vehicles Automotive PCU
JEITA ED-4701/600 Environmental and durability test method of semiconductor device (Specific test for discrete semiconductors) Power semiconductor device