Thermal cycling test (Thermal shock test)
Wide range of settings: -65℃ to 300℃
The thermal shock test evaluates durability of power device against heating cycle between high and low temperature. It evaluates durability of whole power device such as crack phenomenon around semiconductor chip as well as sealing resin, bonding material, solder crack, package crack, and Al slides.
Specification:
High temperature: +80℃ – +300℃
Low temperature: −65℃ – −10℃
Internal dimension (W × H × D mm): 370 × 450 ×
400
Standard
Test | Standard number | Standard | Target objects |
---|---|---|---|
Thermal cycle test (Thermal shock test) |
JIS C 60068-2-14 | Environmental testing-Part 2-14: Change of temperature | Electronic components, equipment, other products |
AQG-324 | Qualification of Power Modules for Use in Power Electronics Converter Units (PCUs) in Motor Vehicles | Automotive PCU | |
JEITA ED4701/302 | Environmental and durability test method of semiconductor device (Strength test I-2) | Power semiconductor device and integrated circuit |