Power Devices Evaluation

Thermal cycling test (Thermal shock test)

Thermal cycling test (Thermal shock test)

Wide range of settings: -65℃ to 300℃

The thermal shock test evaluates durability of power device against heating cycle between high and low temperature. It evaluates durability of whole power device such as crack phenomenon around semiconductor chip as well as sealing resin, bonding material, solder crack, package crack, and Al slides.

Specification:
High temperature: +80℃ – +300℃ 
Low temperature: −65℃ – −10℃
Internal dimension (W × H × D mm): 370 × 450 × 400
Thermal cycle test

Thermal cycle test

Contact information
PIC: Tomoki Sumida (Mr.)
TEL:+81-3-3727-7111
Contact
Evaluation and Business menu

Standard

Test Standard number Standard Target objects
Thermal cycle test
(Thermal shock test)
JIS C 60068-2-14 Environmental testing-Part 2-14: Change of temperature Electronic components, equipment, other products
AQG-324 Qualification of Power Modules for Use in Power Electronics Converter Units (PCUs) in Motor Vehicles Automotive PCU
JEITA ED4701/302 Environmental and durability test method of semiconductor device (Strength test I-2) Power semiconductor device and integrated circuit